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The financing balance of the two cities increased by 13.706 billion yuan. As of December 10, the financing balance of the Shanghai Stock Exchange was 956.648 billion yuan, an increase of 5.195 billion yuan over the previous trading day. The financing balance of Shenzhen Stock Exchange was 909.757 billion yuan, an increase of 8.511 billion yuan over the previous trading day; The two cities totaled 1,866.405 billion yuan, an increase of 13.706 billion yuan over the previous trading day.Shanghai's state-owned assets reform concept stocks rose to the daily limit, and Shanghai Material Trade, First Medicine, Shibei High-tech, Kaikai Industry and Shanghai 900 set an international daily limit.The first day of listing, the new shares of Gem Boyuan opened sharply higher, and now it has risen by over 220%.

The US investment bank explained the downward adjustment of India's economic growth forecast: Based on the short-term economic slowdown and influenced by multiple internal and external factors, according to the Indian media "QRIUS", Uppsala Chachar, chief Indian economist of Morgan Stanley, the US investment bank, predicted that India's GDP growth in fiscal year 2025-2026 would be 6.5%. According to India's Economic Times, at the beginning of this month, Morgan Stanley has lowered India's GDP growth forecast for fiscal year 2024-2025 from the previous 6.7% to 6.3%.The Ministry of Finance issued 6 billion yuan RMB bonds in Hong Kong. Today (11th), the Ministry of Finance issued the sixth issue of RMB bonds in 2024 to professional investors in the Hong Kong Special Administrative Region, with a scale of 6 billion yuan. This year, the Ministry of Finance issued a total of 55 billion RMB bonds in Hong Kong to further improve the normal issuance mechanism of RMB bonds in Hong Kong.The central parity of RMB against the US dollar was reported at 7.1843 yuan.

Wei Shaojun, China Semiconductor Industry Association: The domestic chip design industry has returned to the double-digit high-speed development track. At the Shanghai IC Industry Development Forum 2024, Wei Shaojun, chairman of the IC Design Branch of China Semiconductor Industry Association, said that it is estimated that the domestic chip design industry sales in 2024 will be 646.04 billion yuan, an increase of 11.9% compared with 2023, returning to the double-digit high-speed development track, and the proportion of the global IC product market will be basically the same as last year. In terms of the distribution of industrial cities, Shanghai, Shenzhen and Beijing continue to occupy the top three cities in the scale of design industry this year. Among them, the scale of chip design industry in Shanghai has reached 179.5 billion yuan, which is further widened compared with that in Shenzhen. The scale of design industry in Wuxi has reached 67.82 billion yuan, surpassing Hangzhou and ranking fourth. In 2024, the number of chip design enterprises with sales exceeding 100 million reached 737.Institution: The Q3 revenue of the global semiconductor industry in 2024 reached US$ 158.2 billion, a year-on-year increase of 17%. Counterpoint Research, a market research organization, reported that the global semiconductor market picked up in the third quarter of 2024. Driven by the demand for artificial intelligence technology and the recovery of the memory market, the revenue of the global semiconductor industry in the third quarter reached US$ 158.2 billion, a year-on-year increase of 17%. The top 22 semiconductor suppliers in the world accounted for 73.1% of the market share, which was the same as the same period last year.Haosen Intelligent: It has started to reserve technology in the field of humanoid robot application and equipment. Haosen Intelligent said on the investor interaction platform that the company, as an integrated supplier of intelligent production lines and intelligent equipment, has profound automation, intelligence, informationization and flexibility in the fields of automobile and industrial manufacturing. At present, we have started to reserve technology in the field of humanoid robot application and equipment, which can provide integrated solutions for humanoid robots and AMR robots, and simultaneously lay out humanoid robot production lines and test benches.